Stamping Dies
Motor progressive material is widely used in high-speed and high-precision blanking of motor, motor sheet and EI silicon steel sheet.At the same time, it can provide a variety of standard, non-standard materials, preformed parts (rings), etc.
Cemented Carbide for Electric Motor Progressive Stamping Dies
➤ Cemented Carbide for Electric Motor Progressive Stamping Dies — FM and M Series
The material is widely used for high‑speed stamping of silicon steel sheets, with products extensively applied in the electric motor and motor fields.
Characteristics
◯ Utilizes a mixed‑grain structure, which provides both excellent wear resistance and good chipping resistance.
◯ The latest binder composition design concept endows the alloy with corrosion resistance, making it suitable for electrical discharge machining (EDM).
Application
XR126
Characteristics:
Medium‑fine grain structure with 12% corrosion‑resistant binder phase.
Good toughness, wear resistance, and corrosion resistance.
Application:
Suitable for die making of electric motor laminations in electric tools, automotive motors, washing machines, air conditioners, ballasts, and electricity meters.
XR123
Characteristics:
Medium‑grain tungsten carbide with 12% corrosion‑resistant binder phase.
Good impact resistance and wear resistance.
Application:
Suitable for die making of electric motor laminations in electric tools, automotive motors, washing machines, air conditioners, ballasts, and electricity meters.
XR141
Characteristics:
Medium‑grain tungsten carbide with 15% corrosion‑resistant binder phase.
Good impact resistance.
Application:
Suitable for die making of electric motor laminations in electric tools, automotive motors, washing machines, air conditioners, ballasts, and electricity meters.
Cemented Carbide for Electronics Progressive Stamping Dies
➤ Cemented Carbide for Electronics Progressive Stamping Dies — S and FM Series
The materials are widely used for high‑speed stamping of thin materials such as stainless steel, copper alloys, aluminum alloys, copper foil, aluminum foil, nanocrystalline soft magnetic alloy materials, and microwave‑absorbing materials. The products are extensively applied in the following fields.
Characteristics
◯ Sub‑micron grain size for excellent edge sharpness.
◯ Optimized binder content effectively enhances the material's resistance to chipping.
◯ Latest binder composition design provides corrosion resistance, making it suitable for electrical discharge machining (EDM).
Applications
XR125
Characteristics:
Medium‑fine grain structure with 12% corrosion‑resistant binder phase.
Good toughness.
Application:
Versatile for high‑speed stamping of stainless steel and copper materials with thicknesses up to 1 mm.
XR15ST
Characteristics:
Sub‑micron grain structure with 15% corrosion‑resistant binder phase. Balances toughness and wear resistance.
Application:
Versatile for high‑speed stamping of stainless steel and copper materials with thicknesses up to 0.5 mm.
XR12ST
Characteristics:
Sub‑micron grain structure with 12% corrosion‑resistant binder phase.
Good wear resistance.
Application:
Suitable for high‑speed stamping of stainless steel, copper, copper foil, aluminum foil, nanocrystalline soft magnetic materials, and microwave‑absorbing materials with thicknesses up to 0.3 mm.
XR10ST
Characteristics:
Sub‑micron grain structure with 10% corrosion‑resistant binder phase.
Good wear resistance.
Application:
Suitable for high‑speed stamping of stainless steel materials with thicknesses up to 0.15 mm.
Cemented Carbide for Soft Metal Stamping Dies
➤ Cemented Carbide for Soft Metal Stamping Dies — XR06C
Characteristics
◯ Reduced cobalt content in the binder phase to minimize the adhesion between soft metals and cobalt.
◯ Mixed‑grain structure that provides excellent wear resistance and good chipping resistance.
◯ Latest binder composition design offers corrosion resistance, making it suitable for electrical discharge machining (EDM).
Application
XR06C
Characteristics:
Medium‑coarse grain structure with 6% corrosion‑resistant binder phase.
Good toughness and wear resistance.
Application:
Suitable for high‑speed stamping of soft metals such as pure iron, pure copper, and SPCC (stamping‑quality cold‑rolled steel).
XR06X
Characteristics:
Fine grain structure with 6% corrosion‑resistant binder phase.
Good edge sharpness and wear resistance.
Application:
Suitable for high‑speed stamping of soft metals such as pure iron and pure copper.
Common Sheet Metal Specifications
Cemented Carbide for Semiconductor Die Industry
➤ Cemented Carbide for Semiconductor Packaging Molds — XR10ST, XR12ST
Characteristics
◯ Sub‑micron grain structure with corrosion‑resistant binder phase.
◯ Good wear resistance and polishability.
➤ Cemented Carbide for Semiconductor Lead Frame Blanking — XR125, XR12ST
Characteristics
◯ The upper die material features a medium‑fine grain structure, with a 12% corrosion‑resistant binder phase, providing good toughness. The lower die material features a sub‑micron grain structure, offering good wear resistance.
➤ Cemented Carbide for Semiconductor Lead Frame Trimming Dies — XR12UF and XR12ST
Characteristics
◯ Upper Die Material:Utilizes an ultra‑fine grain structure, providing excellent wear resistance.
Lower Die Material: Features a sub‑micron grain structure, offering good wear resistance and toughness.
Lower Die Material: Features a sub‑micron grain structure, offering good wear resistance and toughness.
Application
◯ The products are widely used in semiconductor packaging, lead frame blanking, trimming, and ejector plates.